ZHCSDE3G February   2015  – October 2022 DP83867CR , DP83867IR

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     7
    2. 6.1 Unused Pins
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Power-Up Timing
    7. 7.7  Reset Timing
    8. 7.8  MII Serial Management Timing
    9. 7.9  RGMII Timing
    10. 7.10 GMII Transmit Timing (1)
    11. 7.11 GMII Receive Timing (1)
    12. 7.12 100-Mbps MII Transmit Timing (1)
    13. 7.13 100-Mbps MII Receive Timing (1)
    14. 7.14 10-Mbps MII Transmit Timing (1)
    15. 7.15 10-Mbps MII Receive Timing (1)
    16. 7.16 DP83867IR/CR Start of Frame Detection Timing
    17. 7.17 Timing Diagrams
    18. 7.18 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 WoL (Wake-on-LAN) Packet Detection
        1. 8.3.1.1 Magic Packet Structure
        2. 8.3.1.2 Magic Packet Example
        3. 8.3.1.3 Wake-on-LAN Configuration and Status
      2. 8.3.2 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 8.3.2.1 SFD Latency Variation and Determinism
          1. 8.3.2.1.1 1000-Mb SFD Variation in Master Mode
          2. 8.3.2.1.2 1000-Mb SFD Variation in Slave Mode
          3. 8.3.2.1.3 100-Mb SFD Variation
      3. 8.3.3 Clock Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 MAC Interfaces
        1. 8.4.1.1 Reduced GMII (RGMII)
          1. 8.4.1.1.1 1000-Mbps Mode Operation
          2. 8.4.1.1.2 1000-Mbps Mode Timing
          3. 8.4.1.1.3 10- and 100-Mbps Mode
        2. 8.4.1.2 Gigabit MII (GMII)
        3. 8.4.1.3 Media Independent Interface (MII)
          1. 8.4.1.3.1 Nibble-wide MII Data Interface
          2. 8.4.1.3.2 Collision Detect
          3. 8.4.1.3.3 Carrier Sense
      2. 8.4.2 Serial Management Interface
        1. 8.4.2.1 Extended Address Space Access
          1. 8.4.2.1.1 Write Address Operation
          2. 8.4.2.1.2 Read Address Operation
          3. 8.4.2.1.3 Write (No Post Increment) Operation
          4. 8.4.2.1.4 Read (No Post Increment) Operation
          5. 8.4.2.1.5 Write (Post Increment) Operation
          6. 8.4.2.1.6 Read (Post Increment) Operation
          7. 8.4.2.1.7 Example of Read Operation Using Indirect Register Access
          8. 8.4.2.1.8 Example of Write Operation Using Indirect Register Access
      3. 8.4.3 Auto-Negotiation
        1. 8.4.3.1 Speed and Duplex Selection - Priority Resolution
        2. 8.4.3.2 Master and Slave Resolution
        3. 8.4.3.3 Pause and Asymmetrical Pause Resolution
        4. 8.4.3.4 Next Page Support
        5. 8.4.3.5 Parallel Detection
        6. 8.4.3.6 Restart Auto-Negotiation
        7. 8.4.3.7 Enabling Auto-Negotiation Through Software
        8. 8.4.3.8 Auto-Negotiation Complete Time
        9. 8.4.3.9 Auto-MDIX Resolution
      4. 8.4.4 Loopback Mode
        1. 8.4.4.1 Near-End Loopback
          1. 8.4.4.1.1 MII Loopback
          2. 8.4.4.1.2 PCS Loopback
          3. 8.4.4.1.3 Digital Loopback
          4. 8.4.4.1.4 Analog Loopback
        2. 8.4.4.2 External Loopback
        3. 8.4.4.3 Far-End (Reverse) Loopback
      5. 8.4.5 BIST Configuration
      6. 8.4.6 Cable Diagnostics
        1. 8.4.6.1 TDR
        2. 8.4.6.2 Energy Detect
        3. 8.4.6.3 Fast Link Detect
        4. 8.4.6.4 Speed Optimization
        5. 8.4.6.5 Mirror Mode
        6. 8.4.6.6 Interrupt
        7. 8.4.6.7 IEEE 802.3 Test Modes
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 LED Operation From 1.8-V I/O VDD Supply
      4. 8.5.4 PHY Address Configuration
      5. 8.5.5 Reset Operation
        1. 8.5.5.1 Hardware Reset
        2. 8.5.5.2 IEEE Software Reset
        3. 8.5.5.3 Global Software Reset
        4. 8.5.5.4 Global Software Restart
      6. 8.5.6 Power-Saving Modes
        1. 8.5.6.1 IEEE Power Down
        2. 8.5.6.2 Deep Power-Down Mode
        3. 8.5.6.3 Active Sleep
        4. 8.5.6.4 Passive Sleep
    6. 8.6 Register Maps
      1. 8.6.1   Basic Mode Control Register (BMCR)
      2. 8.6.2   Basic Mode Status Register (BMSR)
      3. 8.6.3   PHY Identifier Register #1 (PHYIDR1)
      4. 8.6.4   PHY Identifier Register #2 (PHYIDR2)
      5. 8.6.5   Auto-Negotiation Advertisement Register (ANAR)
      6. 8.6.6   Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 8.6.7   Auto-Negotiate Expansion Register (ANER)
      8. 8.6.8   Auto-Negotiation Next Page Transmit Register (ANNPTR)
      9. 8.6.9   Auto-Negotiation Next Page Receive Register (ANNPRR)
      10. 8.6.10  1000BASE-T Configuration Register (CFG1)
      11. 8.6.11  Status Register 1 (STS1)
      12. 8.6.12  Extended Register Addressing
        1. 8.6.12.1 Register Control Register (REGCR)
        2. 8.6.12.2 Address or Data Register (ADDAR)
      13. 8.6.13  1000BASE-T Status Register (1KSCR)
      14. 8.6.14  PHY Control Register (PHYCR)
      15. 8.6.15  PHY Status Register (PHYSTS)
      16. 8.6.16  MII Interrupt Control Register (MICR)
      17. 8.6.17  Interrupt Status Register (ISR)
      18. 8.6.18  Configuration Register 2 (CFG2)
      19. 8.6.19  Receiver Error Counter Register (RECR)
      20. 8.6.20  BIST Control Register (BISCR)
      21. 8.6.21  Status Register 2 (STS2)
      22. 8.6.22  LED Configuration Register 1 (LEDCR1)
      23. 8.6.23  LED Configuration Register 2 (LEDCR2)
      24. 8.6.24  LED Configuration Register (LEDCR3)
      25. 8.6.25  Configuration Register 3 (CFG3)
      26. 8.6.26  Control Register (CTRL)
      27. 8.6.27  Testmode Channel Control (TMCH_CTRL)
      28. 8.6.28  Robust Auto MDIX Timer Configuration Register (AMDIX_TMR_CFG)
      29. 8.6.29  Fast Link Drop Configuration Register (FLD_CFG)
      30. 8.6.30  Fast Link Drop Threshold Configuration Register (FLD_THR_CFG)
      31. 8.6.31  Configuration Register 4 (CFG4)
      32. 8.6.32  RGMII Control Register (RGMIICTL)
      33. 8.6.33  RGMII Control Register 2 (RGMIICTL2)
      34. 8.6.34  100BASE-TX Configuration (100CR)
      35. 8.6.35  Viterbi Module Configuration (VTM_CFG)
      36. 8.6.36  Skew FIFO Status (SKEW_FIFO)
      37. 8.6.37  Strap Configuration Status Register 1 (STRAP_STS1)
      38. 8.6.38  Strap Configuration Status Register 2 (STRAP_STS2)
      39. 8.6.39  BIST Control and Status Register 1 (BICSR1)
      40. 8.6.40  BIST Control and Status Register 2 (BICSR2)
      41. 8.6.41  BIST Control and Status Register 3 (BICSR3)
      42. 8.6.42  BIST Control and Status Register 4 (BICSR4)
      43. 8.6.43  Configuration for Receiver's Equalizer (CRE)
      44. 8.6.44  RGMII Delay Control Register (RGMIIDCTL)
      45. 8.6.45  Configuration of Receiver's LPF (CRLPF)
      46. 8.6.46  Enable Control of Receiver's Equalizer (ECRE)
      47. 8.6.47  PLL Clock-out Control Register (PLLCTL)
      48. 8.6.48  Sync FIFO Control (SYNC_FIFO_CTRL)
      49. 8.6.49  Loopback Configuration Register (LOOPCR)
      50. 8.6.50  DSP Configuration (DSP_CONFIG)
      51. 8.6.51  DSP Feedforward Equalizer Configuration (DSP_FFE_CFG)
      52. 8.6.52  Receive Configuration Register (RXFCFG)
      53. 8.6.53  Receive Status Register (RXFSTS)
      54. 8.6.54  Pattern Match Data Register 1 (RXFPMD1)
      55. 8.6.55  Pattern Match Data Register 2 (RXFPMD2)
      56. 8.6.56  Pattern Match Data Register 3 (RXFPMD3)
      57. 8.6.57  SecureOn Pass Register 2 (RXFSOP1)
      58. 8.6.58  SecureOn Pass Register 2 (RXFSOP2)
      59. 8.6.59  SecureOn Pass Register 3 (RXFSOP3)
      60. 8.6.60  Receive Pattern Register 1 (RXFPAT1)
      61. 8.6.61  Receive Pattern Register 2 (RXFPAT2)
      62. 8.6.62  Receive Pattern Register 3 (RXFPAT3)
      63. 8.6.63  Receive Pattern Register 4 (RXFPAT4)
      64. 8.6.64  Receive Pattern Register 5 (RXFPAT5)
      65. 8.6.65  Receive Pattern Register 6 (RXFPAT6)
      66. 8.6.66  Receive Pattern Register 7 (RXFPAT7)
      67. 8.6.67  Receive Pattern Register 8 (RXFPAT8)
      68. 8.6.68  Receive Pattern Register 9 (RXFPAT9)
      69. 8.6.69  Receive Pattern Register 10 (RXFPAT10)
      70. 8.6.70  Receive Pattern Register 11 (RXFPAT11)
      71. 8.6.71  Receive Pattern Register 12 (RXFPAT12)
      72. 8.6.72  Receive Pattern Register 13 (RXFPAT13)
      73. 8.6.73  Receive Pattern Register 14 (RXFPAT14)
      74. 8.6.74  Receive Pattern Register 15 (RXFPAT15)
      75. 8.6.75  Receive Pattern Register 16 (RXFPAT16)
      76. 8.6.76  Receive Pattern Register 17 (RXFPAT17)
      77. 8.6.77  Receive Pattern Register 18 (RXFPAT18)
      78. 8.6.78  Receive Pattern Register 19 (RXFPAT19)
      79. 8.6.79  Receive Pattern Register 20 (RXFPAT20)
      80. 8.6.80  Receive Pattern Register 21 (RXFPAT21)
      81. 8.6.81  Receive Pattern Register 22 (RXFPAT22)
      82. 8.6.82  Receive Pattern Register 23 (RXFPAT23)
      83. 8.6.83  Receive Pattern Register 24 (RXFPAT24)
      84. 8.6.84  Receive Pattern Register 25 (RXFPAT25)
      85. 8.6.85  Receive Pattern Register 26 (RXFPAT26)
      86. 8.6.86  Receive Pattern Register 27 (RXFPAT27)
      87. 8.6.87  Receive Pattern Register 28 (RXFPAT28)
      88. 8.6.88  Receive Pattern Register 29 (RXFPAT29)
      89. 8.6.89  Receive Pattern Register 30 (RXFPAT30)
      90. 8.6.90  Receive Pattern Register 31 (RXFPAT31)
      91. 8.6.91  Receive Pattern Register 32 (RXFPAT32)
      92. 8.6.92  Receive Pattern Byte Mask Register 1 (RXFPBM1)
      93. 8.6.93  Receive Pattern Byte Mask Register 2 (RXFPBM2)
      94. 8.6.94  Receive Pattern Byte Mask Register 3 (RXFPBM3)
      95. 8.6.95  Receive Pattern Byte Mask Register 4 (RXFPBM4)
      96. 8.6.96  Receive Pattern Control (RXFPATC)
      97. 8.6.97  I/O Configuration (IO_MUX_CFG)
      98. 8.6.98  GPIO Mux Control Register 1 (GPIO_MUX_CTRL1)
      99. 8.6.99  GPIO Mux Control Register 2 (GPIO_MUX_CTRL2)
      100. 8.6.100 GPIO Mux Control Register (GPIO_MUX_CTRL)
      101. 8.6.101 TDR General Configuration Register 1 (TDR_GEN_CFG1)
      102. 8.6.102 TDR Peak Locations Register 1 (TDR_PEAKS_LOC_1)
      103. 8.6.103 TDR Peak Locations Register 2 (TDR_PEAKS_LOC_2)
      104. 8.6.104 TDR Peak Locations Register 3 (TDR_PEAKS_LOC_3)
      105. 8.6.105 TDR Peak Locations Register 4 (TDR_PEAKS_LOC_4)
      106. 8.6.106 TDR Peak Locations Register 5 (TDR_PEAKS_LOC_5)
      107. 8.6.107 TDR Peak Locations Register 6 (TDR_PEAKS_LOC_6)
      108. 8.6.108 TDR Peak Locations Register 7 (TDR_PEAKS_LOC_7)
      109. 8.6.109 TDR Peak Locations Register 8 (TDR_PEAKS_LOC_8)
      110. 8.6.110 TDR Peak Locations Register 9 (TDR_PEAKS_LOC_9)
      111. 8.6.111 TDR Peak Locations Register 10 (TDR_PEAKS_LOC_10)
      112. 8.6.112 TDR Peak Amplitudes Register 1 (TDR_PEAKS_AMP_1)
      113. 8.6.113 TDR Peak Amplitudes Register 2 (TDR_PEAKS_AMP_2)
      114. 8.6.114 TDR Peak Amplitudes Register 3 (TDR_PEAKS_AMP_3)
      115. 8.6.115 TDR Peak Amplitudes Register 4 (TDR_PEAKS_AMP_4)
      116. 8.6.116 TDR Peak Amplitudes Register 5 (TDR_PEAKS_AMP_5)
      117. 8.6.117 TDR Peak Amplitudes Register 6 (TDR_PEAKS_AMP_6)
      118. 8.6.118 TDR Peak Amplitudes Register 7 (TDR_PEAKS_AMP_7)
      119. 8.6.119 TDR Peak Amplitudes Register 8 (TDR_PEAKS_AMP_8)
      120. 8.6.120 TDR Peak Amplitudes Register 9 (TDR_PEAKS_AMP_9)
      121. 8.6.121 TDR Peak Amplitudes Register 10 (TDR_PEAKS_AMP_10)
      122. 8.6.122 TDR General Status (TDR_GEN_STATUS)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Cable Line Driver
        2. 9.2.1.2 Clock In (XI) Recommendation
        3. 9.2.1.3 Crystal Recommendations
        4. 9.2.1.4 Clock Out (CLK_OUT) Phase Noise
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 MAC Interface
          1. 9.2.2.1.1 RGMII Layout Guidelines
          2. 9.2.2.1.2 GMII Layout Guidelines
        2. 9.2.2.2 Media Dependent Interface (MDI)
          1. 9.2.2.2.1 MDI Layout Guidelines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Signal Traces
      2. 11.1.2 Return Path
      3. 11.1.3 Transformer Layout
      4. 11.1.4 Metal Pour
      5. 11.1.5 PCB Layer Stacking
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
    7. 12.7 Trademarks
      1.      Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
  • PAP|64
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision F (October 2019) to Revision G (August 2022)

  • 更新了 IEEE 1588 时间戳的帧起始检测Go
  • Added following wording to the end of first paragraph in Section 8.4.3.9 "DP83867 devices manufactured after August, 2022, have an increased random seed value that now includes 255 different seed values to expedite Auto-MDIX resolution with a link partner."Go
  • Removed Reg 0x01D5 Programmable Gain Register (PROG_GAIN)Go
  • Changed Bit 11:10 SPEED_OPT_ATTEMPT_CNT to RW description in Go
  • Changed bits 15:9, so that bit 12 can be '1'. Bit 7 description updated Section 8.6.31 Go
  • Added Register 0x008AGo
  • Added Register 0x00B3Go
  • Added Register 0x00C0Go
  • Added Register 0x0100Go

Changes from Revision E (March 2017) to Revision F (October 2019)

Changes from Revision C (November 2015) to Revision D (July 2016)

  • Added '(Straps Required)' to RX_DV/RX_CTRL pin in Pin Functions tableGo
  • Changed '1nF' to '1µF' for VDD1P1 and VDD1P0 pin in Pin Functions tableGo
  • Added Operating Junction Temperature to Section 7.3 Go
  • Changed parameter symbol from VIH to VIH in Section 7.5 Go
  • Added MDC toggling clarification to Section 7.7 Go
  • Changed target strap voltage thresholds in Table 8-3 Go
  • Changed 'SPEED_SEL1' to 'ANEG_SEL1' in Table 8-4 Go
  • Added '(Straps Required)' to RX_DV/RX_CTRL in Table 8-4 Go
  • Changed 'SPEED_SEL0' to 'ANEG_SEL' in Table 8-4 Go
  • Changed 'SPEED_SEL0' to 'ANEG_SEL0' in Table 8-4 Go
  • Changed table name from 'PAP Speed Select Strap Details' to Table 8-5 Go
  • Changed 'SPEED_SEL0' and 'SPEED_SEL' to 'ANEG_SEL0' and 'ANEG_SEL1' in Table 8-5 Go
  • Changed table name from 'RGZ Speed Select Strap Details' to Table 8-6 Go
  • Changed 'SPEED_SEL' to 'ANEG_SEL' in Table 8-6 Go
  • Changed Default state of from 'Strap' to '0' for bit 13 in Table 8-9 Go
  • Changed Default state of from 'Strap' to '1' for bit 6 in Table 8-9 Go
  • Changed bit 9 name from 100BASE-T FULL DUPLEX to 1000BASE-T FULL DUPLEX in Table 8-18 Go
  • Changed bit 9 descriptions from half duplex to full duplex in Table 8-18 Go
  • Changed 'Interrupt Status and Event Control Register (ISR)' to 'MII Interrupt Control Register (MICR)' in Section 8.6.16 Go
  • Changed Register definition to move a statement from Section 8.6.17 to Section 8.6.16 Go
  • Changed default of bit 9 from '1' to '0' in Configuration Register 2 (CFG2), Address 0x0014 Go
  • Changed default of bits 5:0 from '0' to '0 0111' in Table 8-27 Go
  • Added Section 8.6.29 registerGo
  • Changed Name of Bits 6:5 from 'STRAP_SPEED_SEL' to 'STRAP_ANEG_SEL' in Table 8-46 Go
  • Changed Name of Bit 6 from 'RESERVED' to 'RESERVED (RGZ)' in Table 8-46 Go
  • Changed Name of Bit 5 from 'STRAP_SPEED_SEL (PAP)' to 'STRAP_SPEED_SEL (RGZ)' in Table 8-46 Go
  • Changed name of Bit 6:4 from 'RESERVED' to 'RESERVED (PAP)' in Table 8-47 Go
  • Added description for 'STRAP_RGMII_CLK_SKEW_TX (RGZ)' in Table 8-47 Go
  • Changed name of Bit 2:0 from 'RESERVED' to 'RESERVED (PAP)' in Table 8-47 Go
  • Added description for 'STRAP_RGMII_CLK_SKEW_RX (RGZ)' in Table 8-47 Go
  • Changed default value of bit 4:0 from '10000' to 'TRIM' in Section 8.6.97 Go
  • Changed description for IO_IMPEDANCE_CTRL bits in Section 8.6.97 Go
  • Changed Section 10 sectionGo
  • Added "The 2.5-V VDDA2P5 can come up with or after the 1.8-V VDDA1P8 but not before it" to Section 10 Go
  • Added Figure 10-3 Go
  • Added Table 10-1 Go
  • Added note regarding 1.8-V supply sequence if no load exists on 2.5-V supply in Section 10 Go

Changes from Revision B (August 2015) to Revision C (November 2015)

Changes from Revision A (June 2015) to Revision B (August 2015)

  • 向 Section 1 列表添加了“功耗低至 490mW”Go
  • 将 Section 3 文本从“DP83867 仅消耗 565mW”更改为“DP83867 仅消耗 490mW”Go
  • Changed Pin RBIAS Description From: "A 10 kΩ +/-1% resistor" To: "A 11 kΩ ±1% resistor".Go
  • Changed Power consumption, 2 supplies TYP value From 565 mW To 530 mW in the Section 7.5 Go
  • Changed Power consumption, optional 3rd supply TYP value From 545 mW To 490 mW in the Section 7.5 Go
  • Changed Register address: From: "BICSR1 register (0x0039)" To: "BICSR2 register (0x0072)", and changed From: "read from the BISCR register (0x0016h)" To: "read from the STS2 register (0x0017h)" in the Section 8.4.5 Go
  • Changed section Section 8.6.39 and Table 8-48 From: Address 0x0039 To: Address 0x0071Go
  • Changed section Section 8.6.40 and Table 8-49 From: Address 0x003A To: Address 0x0072Go

Changes from Revision * (February 2015) to Revision A (June 2015)
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