ホーム マイコン (MCU) / プロセッサ Arm ベースのプロセッサ
ホーム
マイコン (MCU) / プロセッサ
Arm ベースのプロセッサ

TMS320DM8147

アクティブ

DaVinci デジタル メディア プロセッサ

ご注文はこちら
データシート
ユーザー ガイド
エラッタ

TMS320DM8147

アクティブ
データシート ご注文はこちら

製品詳細

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Display type 2 LCD Ethernet MAC 1-Port 10/100/1000 PCIe 1 PCIe Gen 2 Operating system DSP/BIOS, Linux Rating Catalog Power supply solution TPS65050 Operating temperature range (°C) 0 to 90
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Display type 2 LCD Ethernet MAC 1-Port 10/100/1000 PCIe 1 PCIe Gen 2 Operating system DSP/BIOS, Linux Rating Catalog Power supply solution TPS65050 Operating temperature range (°C) 0 to 90
FCBGA (CYE) 684 529 mm² 23 x 23
  • High-Performance DaVinci Video Processors
    • Up to 1-GHz ARM® Cortex®-A8 RISC Core
    • Up to 750-MHz C674x™ VLIW DSP
    • Up to 6000 MIPS and 4500 MFLOPS
    • Fully Software-Compatible with C67x+™, C64x+™
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • Neon™ Multimedia Architecture
      • Supports Integer and Floating Point
      • Jazelle® RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32KB of Instruction and Data Caches
    • 512KB of L2 Cache
    • 64KB of RAM, 48KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32KB of L1P RAM/Cache With EDC
    • 32KB of L1D RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Caches With ECC
  • System Memory Management Unit (MMU)
    • Maps C674x DSP and EDMA TC Memory Accesses to System Addresses
  • 128KB of On-Chip Memory Controller (OCMC) RAM
  • Imaging Subsystem (ISS)
    • Camera Sensor Connection
      • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
    • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
    • Resizer
      • Resizing Image and Video From 1/16x to 8x
      • Generating Two Different Resizing Outputs Concurrently
  • Programmable High-Definition Video Image Coprocessing (HDVICP v2) Engine
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4, SP/ASP, JPEG/MJPEG
  • Media Controller
    • Controls the HDVPSS, HDVICP2, and ISS
  • SGX530 3D Graphics Engine
    • Delivers up to 25 MPoly/sec
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM and DSP Instructions/Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz, 2-channel HD Video Capture Modules
      • One 16-/24-Bit Input or Dual 8-Bit SD Input Channels
      • One 8-/16-/24-Bit Input and One 8-Bit Only Input Channels
    • Two 165-MHz HD Video Display Outputs
      • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
    • Composite or S-Video Analog Output
    • Macrovision® Support Available
    • Digital HDMI 1.3 Transmitter With Integrated PHY
    • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
    • Three Graphics Layers and Compositors
  • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1066
    • Up to Eight x 8 Devices Total 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • General-Purpose Memory Controller (GPMC)
    • 8- or 16-Bit Multiplexed Address and Data Bus
    • 512MB of Address Space Divided Among up to 8 Chip Selects
    • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide Up to 16-Bit or 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
  • Enhanced Direct Memory Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Independent QDMA Channels
  • Dual Port Ethernet (10/100/1000 Mbps) With Optional Switch
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII/RMII/GMII/RGMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
    • Reset Isolation
    • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
  • Dual USB 2.0 Ports With Integrated PHYs
    • USB2.0 High- and Full-Speed Clients
    • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
    • Supports End Points 0–15
  • One PCI Express 2.0 Port With Integrated PHY
    • Single Port With One Lane at 5.0 GT/s
    • Configurable as Root Complex or Endpoint
  • Eight 32-Bit General-Purpose Timers (Timer1–8)
  • One System Watchdog Timer (WDT0)
  • Six Configurable UART/IrDA/CIR Modules
    • UART0 With Modem Control Signals
    • Supports up to 3.6864 Mbps UART0/1/2
    • Supports up to 12 Mbps UART3/4/5
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • Four Serial Peripheral Interfaces (SPIs) (up to
    48 MHz)
    • Each With Four Chip Selects
  • Three MMC/SD/SDIO Serial Interfaces (up to
    48 MHz)
    • Three Supporting up to 1-, 4-, or 8-Bit Modes
  • Dual Controller Area Network (DCAN) Modules
    • CAN Version 2 Part A, B
  • Four Inter-Integrated Circuit (I2C Bus) Ports
  • Six Multichannel Audio Serial Ports (McASPs)
    • Dual Ten Serializer Transmit and Receive Ports
    • Quad Four Serializer Transmit and Receive Ports
    • DIT-Capable For S/PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
    • Direct Interface to One Hard Disk Drive
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 128 General-Purpose I/O (GPIO) Pins
  • One Spin Lock Module with up to 128 Hardware Semaphores
  • One Mailbox Module with 12 Mailboxes
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • Multiple Independent Core Power Domains
    • Multiple Independent Core Voltage Domains
    • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
    • Clock Enable and Disable Control for Subsystems and Peripherals
  • 32KB of Embedded Trace Buffer (ETB) and
    5-Pin Trace Interface for Debug
  • IEEE 1149.1 (JTAG) Compatible
  • 684-Pin Pb-Free BGA Package (CYE Suffix), 0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
  • 45-nm CMOS Technology
  • 1.8- and 3.3-V Dual Voltage Buffers for General I/O
  • High-Performance DaVinci Video Processors
    • Up to 1-GHz ARM® Cortex®-A8 RISC Core
    • Up to 750-MHz C674x™ VLIW DSP
    • Up to 6000 MIPS and 4500 MFLOPS
    • Fully Software-Compatible with C67x+™, C64x+™
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • Neon™ Multimedia Architecture
      • Supports Integer and Floating Point
      • Jazelle® RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32KB of Instruction and Data Caches
    • 512KB of L2 Cache
    • 64KB of RAM, 48KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32KB of L1P RAM/Cache With EDC
    • 32KB of L1D RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Caches With ECC
  • System Memory Management Unit (MMU)
    • Maps C674x DSP and EDMA TC Memory Accesses to System Addresses
  • 128KB of On-Chip Memory Controller (OCMC) RAM
  • Imaging Subsystem (ISS)
    • Camera Sensor Connection
      • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
    • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
    • Resizer
      • Resizing Image and Video From 1/16x to 8x
      • Generating Two Different Resizing Outputs Concurrently
  • Programmable High-Definition Video Image Coprocessing (HDVICP v2) Engine
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4, SP/ASP, JPEG/MJPEG
  • Media Controller
    • Controls the HDVPSS, HDVICP2, and ISS
  • SGX530 3D Graphics Engine
    • Delivers up to 25 MPoly/sec
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM and DSP Instructions/Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz, 2-channel HD Video Capture Modules
      • One 16-/24-Bit Input or Dual 8-Bit SD Input Channels
      • One 8-/16-/24-Bit Input and One 8-Bit Only Input Channels
    • Two 165-MHz HD Video Display Outputs
      • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
    • Composite or S-Video Analog Output
    • Macrovision® Support Available
    • Digital HDMI 1.3 Transmitter With Integrated PHY
    • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
    • Three Graphics Layers and Compositors
  • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1066
    • Up to Eight x 8 Devices Total 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • General-Purpose Memory Controller (GPMC)
    • 8- or 16-Bit Multiplexed Address and Data Bus
    • 512MB of Address Space Divided Among up to 8 Chip Selects
    • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide Up to 16-Bit or 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
  • Enhanced Direct Memory Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Independent QDMA Channels
  • Dual Port Ethernet (10/100/1000 Mbps) With Optional Switch
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII/RMII/GMII/RGMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
    • Reset Isolation
    • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
  • Dual USB 2.0 Ports With Integrated PHYs
    • USB2.0 High- and Full-Speed Clients
    • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
    • Supports End Points 0–15
  • One PCI Express 2.0 Port With Integrated PHY
    • Single Port With One Lane at 5.0 GT/s
    • Configurable as Root Complex or Endpoint
  • Eight 32-Bit General-Purpose Timers (Timer1–8)
  • One System Watchdog Timer (WDT0)
  • Six Configurable UART/IrDA/CIR Modules
    • UART0 With Modem Control Signals
    • Supports up to 3.6864 Mbps UART0/1/2
    • Supports up to 12 Mbps UART3/4/5
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • Four Serial Peripheral Interfaces (SPIs) (up to
    48 MHz)
    • Each With Four Chip Selects
  • Three MMC/SD/SDIO Serial Interfaces (up to
    48 MHz)
    • Three Supporting up to 1-, 4-, or 8-Bit Modes
  • Dual Controller Area Network (DCAN) Modules
    • CAN Version 2 Part A, B
  • Four Inter-Integrated Circuit (I2C Bus) Ports
  • Six Multichannel Audio Serial Ports (McASPs)
    • Dual Ten Serializer Transmit and Receive Ports
    • Quad Four Serializer Transmit and Receive Ports
    • DIT-Capable For S/PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
    • Direct Interface to One Hard Disk Drive
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 128 General-Purpose I/O (GPIO) Pins
  • One Spin Lock Module with up to 128 Hardware Semaphores
  • One Mailbox Module with 12 Mailboxes
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • Multiple Independent Core Power Domains
    • Multiple Independent Core Voltage Domains
    • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
    • Clock Enable and Disable Control for Subsystems and Peripherals
  • 32KB of Embedded Trace Buffer (ETB) and
    5-Pin Trace Interface for Debug
  • IEEE 1149.1 (JTAG) Compatible
  • 684-Pin Pb-Free BGA Package (CYE Suffix), 0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
  • 45-nm CMOS Technology
  • 1.8- and 3.3-V Dual Voltage Buffers for General I/O

TMS320DM814x DaVinci video processors are highly integrated, programmable platforms that leverage the DaVinci processor technology to meet the processing needs of the following applications to name a few: HD Video Conferencing - Skype endpoints Video Surveillance DVRs IP Netcam Digital Signage Media Players and Adapters Mobile Medical Imaging Network Projectors Home Audio and Video Equipment

The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable video and audio processing with a highly integrated peripheral set.

The TMS320DM814x DaVinci video processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM that used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x DSP core along with a video encoder and decoder to the hardware on the AM38x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM lets developers keep control functions separate from A/V algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-Bit RISC Core with Neon floating-point extension includes: 32KB of Instruction cache; 32KB of Data cache; 512KB of L2 Cache; 48KB of Boot ROM; and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem Dual Port Gigabit Ethernet MACs (10/100/1000 Mbps) [Ethernet Switch] with MII/RMII/GMII/RGMII and MDIO interface supporting IEEE 1588 Time-Stamping and Industrial Ethernet ProtocolsTwo USB ports with integrated 2.0 PHY PCIe x1 GEN2 Compliant interfaceTwo 10-serializer McASP audio serial ports (with DIT mode)Four quad-serilaizer McASP audio serial ports (with DIT mode)One McBSP multichannel buffered serial portSix UARTs with IrDA and CIR supportFour SPI serial interfacesThree MMC/SD/SDIO serial interfacesFour I2C master and slave interfaces Parallel Camera Interface (CAM)Up to 128 General-Purpose I/Os (GPIOs)Eight 32-bit general-purpose timers System watchdog timer Dual DDR2, and DDR3 SDRAM interfacesFlexible 8- or 16-bit asynchronous memory interfaceTwo Controller Area Network (DCAN) modulesSpin LockMailboxSerial Hard Disk Drive Interface (SATA 300)

The TMS320DM814x DaVinci video processors also include a high-definition video and imaging coprocessor 2 (HDVICP2), and an SGX530 3D graphics engine to off-load many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. Additionally, it has a complete set of development tools for both the ARM and DSP, which include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft® Windows® debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform and is code-compatible with previous generation C64x Fixed-Point and C67x Floating-Point DSP generation. The C674x Floating-Point DSP processor uses 32KB of L1 program memory with EDC and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining memory is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining memory is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM with ECC, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through an MMU.

TMS320DM814x DaVinci video processors are highly integrated, programmable platforms that leverage the DaVinci processor technology to meet the processing needs of the following applications to name a few: HD Video Conferencing - Skype endpoints Video Surveillance DVRs IP Netcam Digital Signage Media Players and Adapters Mobile Medical Imaging Network Projectors Home Audio and Video Equipment

The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable video and audio processing with a highly integrated peripheral set.

The TMS320DM814x DaVinci video processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM that used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x DSP core along with a video encoder and decoder to the hardware on the AM38x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.

Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM lets developers keep control functions separate from A/V algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-Bit RISC Core with Neon floating-point extension includes: 32KB of Instruction cache; 32KB of Data cache; 512KB of L2 Cache; 48KB of Boot ROM; and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem Dual Port Gigabit Ethernet MACs (10/100/1000 Mbps) [Ethernet Switch] with MII/RMII/GMII/RGMII and MDIO interface supporting IEEE 1588 Time-Stamping and Industrial Ethernet ProtocolsTwo USB ports with integrated 2.0 PHY PCIe x1 GEN2 Compliant interfaceTwo 10-serializer McASP audio serial ports (with DIT mode)Four quad-serilaizer McASP audio serial ports (with DIT mode)One McBSP multichannel buffered serial portSix UARTs with IrDA and CIR supportFour SPI serial interfacesThree MMC/SD/SDIO serial interfacesFour I2C master and slave interfaces Parallel Camera Interface (CAM)Up to 128 General-Purpose I/Os (GPIOs)Eight 32-bit general-purpose timers System watchdog timer Dual DDR2, and DDR3 SDRAM interfacesFlexible 8- or 16-bit asynchronous memory interfaceTwo Controller Area Network (DCAN) modulesSpin LockMailboxSerial Hard Disk Drive Interface (SATA 300)

The TMS320DM814x DaVinci video processors also include a high-definition video and imaging coprocessor 2 (HDVICP2), and an SGX530 3D graphics engine to off-load many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. Additionally, it has a complete set of development tools for both the ARM and DSP, which include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft® Windows® debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform and is code-compatible with previous generation C64x Fixed-Point and C67x Floating-Point DSP generation. The C674x Floating-Point DSP processor uses 32KB of L1 program memory with EDC and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining memory is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining memory is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM with ECC, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through an MMU.
filter その他の Arm ベースのプロセッサ を検索
ダウンロード 字幕付きのビデオを表示 ビデオ
サード パーティーによるサポート

TI は、この製品に対する継続的な直接の設計サポートを実施していません。開発中の設計に関する継続的なサポートをご希望の場合、以下のサード パーティーのいずれかにお問い合わせください。D3 Engineering、elnfochips、Ittiam Systems、Path Partner Technology、Z3 Technologies の各社。

技術資料

star =TI が選定したこの製品の主要ドキュメント
結果が見つかりませんでした。検索条件をクリアしてから、再度検索を試してください。
11 をすべて表示
種類 タイトル 最新の英語版をダウンロード 日付
* データシート TMS320DM814x DaVinci Video Processors データシート (Rev. E) 2013年 12月 13日
* エラッタ TMS320DM814x DaVinci Digital Media Processor Errata (Silicon Revs 3.0, 2.1) (Rev. C) 2013年 4月 15日
* ユーザー・ガイド TMS320DM8127 and TMS320DM814x DaVinci™ Digital Media Processors TRM (Rev. G) 2016年 6月 30日
アプリケーション・ノート High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023年 2月 24日
アプリケーション・ノート Error Detection and Correction Mechanism of TMS320C64x+/C674x (Rev. A) 2013年 7月 19日
その他の技術資料 DM81x Design Network Partners 2012年 6月 5日
アプリケーション・ノート TI814x-DDR3-Init-U-Boot 2011年 10月 31日
アプリケーション・ノート Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
製品概要 Software Makes Development Easy for DM8168 and DM8148 2011年 3月 1日
製品概要 Video Analytics on TI's Davinci Digital Media Processors Backgrounder 2011年 3月 1日
ユーザー・ガイド TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 2010年 7月 30日

設計および開発

その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。

評価ボード

Z3-3P-VIDEO-EVMS — Z3 Technology 社プロセッサ・ビデオの評価モジュール

Z3 は、TI の DaVinci および AM57x プロセッサにフォーカスしオープンソース・ソフトウェア・アーキテクチャの開発、サポートを行います。取り扱い製品には、マルチメディア向けのフレームワーク、周辺装置ドライバ、製造モジュール、および包括的な製品設計サービスが含まれます。さらに Z3 は、システム・レベル設計と、有線およびワイヤレスの両方のメディア製品も提供します。

Z3 Technology の詳細については、http://z3technology.com でご確認ください。

購入先：Z3 Technology
View Options
デバッグ・プローブ

TMDSEMU200-U — XDS200 USB デバッグ・プローブ

XDS200 は、TI の組込みデバイスのデバッグに使用できるデバッグ・プローブ (エミュレータ) です。XDS200 は、低コストの XDS110 と高性能の XDS560v2 に比べて、低コストと良好な性能のバランスを特長としています。単一のポッド (筐体) で、多様な規格 (IEEE1149.1、IEEE1149.7、SWD) をサポートします。すべての XDS デバッグ・プローブは、組込みトレース・バッファ (ETB) を搭載しているすべての Arm® プロセッサと DSP プロセッサで、コア・トレースとシステム・トレースをサポートしています。ピン経由でコア・トレースを実行する場合、 (...)

TI.com で取り扱いなし
デバッグ・プローブ

TMDSEMU560V2STM-U — XDS560™ ソフトウェア v2 システム・トレース USB デバッグ・プローブ

XDS560v2 は、XDS560™ ファミリのデバッグ・プローブの中で最高の性能を達成し、従来の JTAG 規格 (IEEE1149.1) と cJTAG (IEEE1149.7) の両方をサポートしています。シリアル・ワイヤ・デバッグ (SWD) をサポートしていないことに注意してください。

すべての XDS デバッグ・プローブは、組み込みトレース・バッファ (ETB) を搭載しているすべての ARM プロセッサと DSP プロセッサで、コア・トレースとシステム・トレースをサポートしています。ピン経由でコア・トレースを実行する場合、XDS560v2 PRO TRACE が必要です。

(...)

TI.com で取り扱いなし
デバッグ・プローブ

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 システム・トレース USB およびイーサネット

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

TI.com で取り扱いなし
ソフトウェア開発キット (SDK)

LINUXEZSDK-DAVINCI — Linux EZ ソフトウェア開発キット（EZSDK）、DM814x および DM816x 向け - ALPHA

The Linux EZ Software Development Kit (EZ SDK) allows customers to evaluate their devices in minutes and begin development in less than an hour. This kit provides everything DaVinci™ developers need to evaluate and start developing on the DaVinci™ DM816x/DM814x processors. With the (...)

サポート対象の製品とハードウェア

サポート対象の製品とハードウェア

製品
Arm ベースのプロセッサ
TMS320DM8127 — DaVinci デジタル メディア プロセッサ TMS320DM8147 — DaVinci デジタル メディア プロセッサ TMS320DM8148 — DaVinci デジタル メディア プロセッサ
デジタル信号プロセッサ (DSP)
TMS320DM8165 — DaVinci デジタル メディア プロセッサ TMS320DM8167 — DaVinci デジタル メディア プロセッサ TMS320DM8168 — DaVinci デジタル メディア プロセッサ
ダウンロードオプション
ドライバまたはライブラリ

SPRC264 — C64x+IMGLIB

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
ユーザー ガイド: PDF
View Options
ドライバまたはライブラリ

SPRC265 — C64x+DSPLIB

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
ユーザー ガイド: PDF
View Options
IDE (統合開発環境)、コンパイラ、またはデバッガ

CCSTUDIO — Code Composer Studio 統合開発環境（IDE）

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

サポート対象の製品とハードウェア

サポート対象の製品とハードウェア

こちらの設計リソースは、このカテゴリに属する製品の大半をサポートしています。

サポート状況を確認するには、製品の詳細ページをご覧ください。
開始 ダウンロードオプション
シミュレーション・モデル

DM814x, DM8127 CYE BSDL Model (Rev. A)

SPRM550A.ZIP (16 KB) - BSDL Model
ダウンロード
パッケージ ピン数 CAD シンボル、フットプリント、および 3D モデル
FCBGA (CYE) 684 Ultra Librarian
TI の評価品に関する標準契約約款が適用されます。

購入と品質

記載されている情報：
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 使用原材料
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報：
  • ファブの拠点
  • 組み立てを実施した拠点

サポートとトレーニング

TI E2E™ フォーラムでは、TI のエンジニアからの技術サポートを提供

投稿されたすべてのフォーラムトピック (英語) を表示

コンテンツは、TI 投稿者やコミュニティ投稿者によって「現状のまま」提供されるもので、TI による仕様の追加を意図するものではありません。使用条件をご確認ください。

TI 製品の品質、パッケージ、ご注文に関するお問い合わせは、TI サポートをご覧ください。​​​​​​​​​​​​​​

ビデオ