DAC7512
- microPOWER OPERATION: 135uA at 5V
- POWER-DOWN: 200nA at 5V, 50nA at 3V
- POWER SUPPLY: +2.7V to +5.5V
- TESTED MONOTONIC BY DESIGN
- POWER-ON RESET TO 0V
- THREE POWER-DOWN FUNCTIONS
- LOW POWER SERIAL INTERFACE WITH SCHMITT-TRIGGERED INPUTS
- ON-CHIP OUTPUT BUFFER AMPLIFIER, RAIL-TO-RAIL OPERATION
- SYNC\ INTERRUPT FACILITY
- SOT23-6 AND MSOP-8 PACKAGES
- APPLICATIONS
- PORTABLE BATTERY-POWERED INSTRUMENTS
- DIGITAL GAIN AND OFFSET ADJUSTMENT
- PROGRAMMABLE VOLTAGE AND CURRENT SOURCES
SPI and QSPI are registered trademarks of Motorola.
Microwire is a registered trademark of National Semiconductor.
The DAC7512 is a low-power, single, 12-bit buffered voltage output Digital-to-Analog Converter (DAC). Its on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The DAC7512 uses a versatile three-wire serial interface that operates at clock rates up to 30MHz and is compatible with standard SPI™, QSPI™, Microwire™, and DSP interfaces.
The reference for the DAC7512 is derived from the power supply, resulting in the widest dynamic output range possible. The DAC7512 incorporates a power-on reset circuit that ensures that the DAC output powers up at 0V and remains there until a valid write takes place in the device. The DAC7512 contains a power-down feature, accessed over the serial interface, that can reduce the current consumption of the device to 50nA at 5V.
The low power consumption of this part in normal operation makes it ideally suited to portable battery-operated equipment. The power consumption is 0.7mW at 5V reducing to 1uW in power-down mode.
The DAC7512 is available in a SOT23-6 package and an MSOP-8 package.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Low-Power Rail-To-Rail Output 12-Bit Serial Input D/A Converter 数据表 (Rev. B) | 2002年 10月 11日 | |||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 | ||||
应用手册 | 高速数据转换 | 英语版 | 2008年 10月 16日 |
设计和开发
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Linux Mainline Status
Available in Linux Main line: Yes
Available through git.ti.com: N/A
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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