DAC6574
- Micropower Operation: 500 µA at 3 V VDD
- Fast Update Rate: 188 kSPS
- Per-channel Power-down Capability
- Power-On Reset to Zero
- 2.7 V to 5.5 V Analog Power Supply
- 10-Bit Monotonic
- I²C™ Interface Up to 3.4 Mbps
- Data Transmit Capability
- On-Chip Output Buffer Amplifier, Rail-to-Rail Operation
- Double-Buffered Input Register
- Address Support for up to Four DAC6574s
- Synchronous Update Support for up to 16 Channels
- Operation From –40°C to 105°C
- Small 10 Lead MSOP Package
- APPLICATIONS
- Process Control
- Data Acquisition Systems
- Closed-Loop Servo Control
- PC Peripherals
- Portable Instrumentation
I²C is a trademark of Philips Corporation.
The DAC6574 is a low-power, quad channel, 10-bit buffered voltage output DAC. Its on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The DAC6574 utilizes an I²C compatible two wire serial interface supporting high-speed interface mode with address support of up to four DAC6574s for a total of 16 channels on the bus.
The DAC6574 uses VDD and GND to set the output range of the DAC. The DAC6574 incorporates a power-on-reset circuit that ensures that the DAC output powers up at zero volts and remains there until a valid write takes place to the device. The DAC6574 contains a per-channel power-down feature, accessed via the internal control register, that reduces the current consumption of the device to 200 nA at 5 V.
The low power consumption of this part in normal operation makes it ideally suited to portable battery operated equipment. The power consumption is less than 3mW at VDD = 5 V reducing to 1 µW in power-down mode.
TI offers a variety of data converters with I²C interface. See DACx57x family of 16/12/10/8 bit, single and quad channel DACs. Also see ADS7823 and ADS1100, 12-bit octal channel and 16-bit single channel ADCs.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | DAC6574: Quad,10-Bit, Low-Power, Voltage Output, I2C Interface DAC 数据表 | 2003年 12月 8日 | |||
应用手册 | A Basic Guide to I2C | PDF | HTML | 2022年 11月 8日 | |||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 | ||||
应用手册 | 高速数据转换 | 英语版 | 2008年 10月 16日 | |||
用户指南 | DAC7571/4, DA6571/4, DAC5571/4, DAC8571 EVM (Rev. A) | 2004年 2月 5日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VSSOP (DGS) | 10 | Ultra Librarian |
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