TLV5638M
- Dual 12-Bit Voltage Output DAC
- Programmable Internal Reference
- Programmable Settling Time:
- 1 µs in Fast Mode,
- 3.5 µs in Slow Mode
- Compatible With TMS320 and SPITM Serial Ports
- Differential Nonlinearity <0.5 LSB Typ
- Monotonic Over Temperature
- Applications
- Digital Servo Control Loops
- Digital Offset and Gain Adjustment
- Industrial Process Control
- Machine and Motion Control Devices
- Mass Storage Devices
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows glueless interface to TMS320 and SPITM, QSPITM, and MicrowireTM serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5638 simplifies overall system design.
Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in an 8-pin SOIC package to reduce board space in standard commercial, industrial, and automotive temperature ranges. It is also available in JG and FK packages in the military temperature range.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TLV5638; 2.7-V To 5.5-V Low Power Dual 12-Bit DAC w/ Internal Ref & Power Down 数据表 (Rev. C) | 2004年 1月 16日 | |||
* | SMD | TLV5638M SMD 5962-99576 | 2016年 6月 21日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
CDIP (JG) | 8 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点