TLV5606
- 10-Bit Voltage Output DAC
- Programmable Settling Time vs Power Consumption
- 3 µs in Fast Mode
- 9 µs in Slow Mode
- Ultra Low Power Consumption:
- 900 µW Typ in Slow Mode at 3 V
- 2.1 mW Typ in Fast Mode at 3 V
- Differential Nonlinearity . . . <0.2 LSB Typ
- Compatible With TMS320 and SPI Serial Ports
- Power-Down Mode (10 nA)
- Buffered High-Impedance Reference Input
- Voltage Output Range . . . 2 Times the Reference Input Voltage
- Monotonic Over Temperature
- Available in MSOP Package
The TLV5606 is a 10-bit voltage output digital-to-analog converter (DAC) with a flexible 4-wire serial interface. The 4-wire serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5606 is programmed with a 16-bit serial string containing 4 control and 10 data bits. Developed for a wide range of supply voltages, the TLV5606 can operate from 2.7 V to 5.5 V.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The settling time of the DAC is programmable to allow the designer to optimize speed versus power dissipation. The settling time is chosen by the control bits within the 16-bit serial input string. A high-impedance buffer is integrated on the REFIN terminal to reduce the need for a low source impedance drive to the terminal.
Implemented with a CMOS process, the TLV5606 is designed for single supply operation from 2.7 V to 5.5 V. The device is available in an 8-terminal SOIC package. The TLV5606C is characterized for operation from 0°C to 70°C. The TLV5606I is characterized for operation from -40°C to 85°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 2.7V to 5.5V Low Power 10-Bit Digital-to-Analog Converters with Power Down 数据表 (Rev. B) | 2004年 4月 8日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点